JUMP 2.0 consortium aims for innovation in microelectronics | business | January 2023

DURHAM, NC January 11, 2023 – Semiconductor Research Corp. (SRC), along with the Defense Advanced Research Projects Agency (DARPA) and stakeholders from industry and academia, launched the Joint University Microelectronics Program 2.0 (JUMP 2.0). The SRC-led effort expands on the original JUMP collaboration, which aims to accelerate US advances in information and communications technologies. The consortium established as part of JUMP 2.0 will conduct high-risk, high-return research spread across seven thematically structured centers.

Each multidisciplinary center will focus on an overarching research topic that has been identified as key to addressing emerging engineering challenges. These defined interests, spurred by an increasingly connected world and a rapidly changing microelectronics landscape, will centralize long-term, breakthrough research aimed at breakthroughs applicable in defense and academia.

According to Adam Knapp, JUMP program manager, the program embeds connections from SRC’s corporate sponsors into the research centers themselves. Research will be aligned to areas of interest for industry and government through an ongoing dialogue between industry and academic representatives, Knapp said.

“All research, data and code generated is independent of background IP and is available to our sponsors in both industry and government prior to publication,” Knapp said in an email to Photonics Media.

Sponsors can then use that work royalty-free, or build upon it and incorporate it into products, or request patent protection.

Additionally, as part of the DARPA Electronics Resurgence Initiative, JUMP 2.0 aims to significantly improve the performance, efficiency and capabilities of a range of electronics systems.

“10 years from now, JUMP 2.0 envisions a world where Moore’s Law is breathed new life, where the Internet of Things can use RF-enabled sensors in conjunction with photonic communication techniques to route compute needs across the edge or back into the cloud,” Knapp said. “These capabilities are enabled by advances in cost-effective, heterogeneously integrated memory and logic utilizing the newly developed materials and devices supported by this program.”

An ultra-compact photonic data transmission system.  Courtesy of Lightwave Research Lab, Columbia Engineering.

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An ultra-compact photonic data transmission system. Courtesy of Lightwave Research Lab/Columbia Engineering.

To this end, the centers will focus on the seven complementary research themes of JUMP 2.0: cognition; communication and connectivity; Intelligent Perception to Action; systems and architectures for distributed computing; Smart memory and storage; Advanced monolithic and heterogeneous integration; and energy-efficient high-performance devices.

Partnerships with research institutions

The Georgia Institute of Technology (Georgia Tech) will lead two of the seven centers. An investment of approximately $65.7 million will establish the Center for the Co-Design of Cognitive Systems (COCOSYS) and the Center on Cognitive Multispectral Sensors (COGNISENSE) at the university. COCOSYS is tasked with developing next-generation AI systems and architectures. COGNISENSE will focus on sensor capabilities and embedded intelligence to enable fast and efficient generation of actions.

Columbia University will host the Center for Ubiquitous Connectivity, or CUBiC, to be established via a five-year, $35 million grant. The center will focus on advancing energy-efficient communications technologies to address the vastly increasing connectivity bottlenecks between data-hungry wireless devices and swamped data centers. The principal researchers of the CUbiC team, led by Professor Keren Bergman, include electrical engineering professor and integrated circuits expert Harish Krishnaswamy, and applied physics professor and silicon photonics pioneer Michal Lipson.

The University of Illinois at Urbana-Champaign will host the ACE Center for Evolvable Computing, which will target Jump 2.0’s topic, Systems and Architectures for Distributed Computing. The center will have a budget of US$39.6 million over five years.

The University of California, San Diego was awarded a $35 million grant to the Center for Processing with Intelligent Storage and Memory (PRISM). The center, which focuses on the topic of Intelligent Memory and Storage, will work on new storage devices and storage arrays for intelligent storage systems. A group of 10 universities will join forces and contribute additional funds to create the $50.5 million center.

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The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) is being established at Pennsylvania State University (Penn State) thanks to a $32.7 million grant. CHIMES participants will explore 23 research tasks under four synergistic themes, including system-driven functional integration and aggregation; 3D monolithic densification and diversification on a silicon platform; ultra-dense heterogeneous interconnection and assembly; and material behavior, synthesis, metrology and reliability.

Cornell University will establish the Superior Energy-Efficient Materials and Devices (SUPREME) Center. Huili Grace Xing, William L. Quackenbush Professor of Engineering in Materials Science and Technology and Electrical and Computer Engineering at Cornell Engineering, will serve as director of the center. Tomás Palacios, director of Microsystems Technology Laboratories and professor of electrical engineering and computer science at MIT, will serve as deputy director of the center. The center’s executive director will be Thomas Dienel, a condensed matter physicist who leads the Cornell Platform for Accelerated Realization, Analysis and Discovery of Interface Materials (PARADIM) user program. The $34 million center is funded by the SRC and its 14 partner universities. Cornell’s investment in the five-year project will be $7 million.

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